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Interface - Sensor and Detector Interfaces
| Image | Part Number | Manufacturers | Description | Lead Free | RoHS | View |
|---|---|---|---|---|---|---|
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ZSSC3015NA1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3015NE1B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
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ZSSC3015NE1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3015NE1D | Integrated Device Technology | DICE (WAFER SAWN) - WAFFLE PACK | Contains Lead | compliant | RFQ >> |
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ZSSC3016CC1B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
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ZSSC3016CC1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3016CC6B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
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ZSSC3016CI1B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
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ZSSC3016CI1BP | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
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ZSSC3016CI1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3016CI6B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
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ZSSC3016DI1B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
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ZSSC3016DI6B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
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ZSSC3018BA2C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3018BA2D ES | Integrated Device Technology | DICE (WAFER SAWN) - WAFFLE PACK | Contains Lead | compliant | RFQ >> |
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ZSSC3026CC1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3026CC6C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3026CI1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3122AI1B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
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ZSSC3122AI1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3123AA1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3123AI1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3131BA1B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
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ZSSC3131BA1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3131BA1D | Integrated Device Technology | DICE (WAFER SAWN) - WAFFLE PACK | Contains Lead | compliant | RFQ >> |
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ZSSC3131BE1B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
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ZSSC3131BE1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3131BE1D | Integrated Device Technology | DICE (WAFER SAWN) - WAFFLE PACK | Contains Lead | compliant | RFQ >> |
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ZSSC3135BA1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3135BE1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3136BA1B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
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ZSSC3136BA1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3136BA1D | Integrated Device Technology | DICE (WAFER SAWN) - WAFFLE PACK | Contains Lead | compliant | RFQ >> |
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ZSSC3136BE1B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
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ZSSC3136BE1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3136BE1D | Integrated Device Technology | DICE (WAFER SAWN) - WAFFLE PACK | Contains Lead | compliant | RFQ >> |
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ZSSC3138BA1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3138BE1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3154BA1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3154BE1B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
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ZSSC3154BE1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3154BE1D | Integrated Device Technology | DICE (WAFER SAWN) - WAFFLE PACK | Contains Lead | compliant | RFQ >> |
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ZSSC3170EA1B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
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ZSSC3170EA1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3170EA1D | Integrated Device Technology | DICE (WAFER SAWN) - WAFFLE PACK | Contains Lead | compliant | RFQ >> |
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ZSSC3170EE1B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
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ZSSC3170EE1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
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ZSSC3170EE1D | Integrated Device Technology | DICE (WAFER SAWN) - WAFFLE PACK | Contains Lead | compliant | RFQ >> |
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ZSSC3170FE1B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
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ZSSC3170FE1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
